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Ayyappan, K.
- Performance Analysis of Rectangular MPA Using Different Substrate Materials for WLAN Application
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Authors
Affiliations
1 Department of Electronics and Communication Engineering, Rajiv Gandhi College of Engineering and Technology, IN
2 Department of Electronics and Communication Engineering, SRM University, IN
1 Department of Electronics and Communication Engineering, Rajiv Gandhi College of Engineering and Technology, IN
2 Department of Electronics and Communication Engineering, SRM University, IN
Source
ICTACT Journal on Communication Technology, Vol 8, No 1 (2017), Pagination: 1447-1452Abstract
In this paper, a rectangular microstrip patch antenna (MPA) is designed using different substrate materials for analyzing the performance of the MPA. Alumina (Al2O3), Bakelite, Beryllium oxide (BeO), Gallium Arsenide (GaAs), RT-Duroid and Flame Retardant 4 (FR-4) are the six different substrate used in the design. The size of the rectangular microstrip patch antenna varies according to the dielectric constant of substrate materials used. The operating frequency taken for this analysis is 5.8 GHz. The proposed design provides the study on the performance of rectangular microstrip patch antenna for different substrate materials using the same frequency. This study conveys that which substrate material provides better performance. Moreover, this comparative study conveys that which substrate material provides better performance. The simulation parameters are investigated using HFSS.Keywords
Rectangular Microstrip Patch, Substrate Materials, Al2O3, Bakelite, BeO, GaAs, RT-Duroid and FR-4 and HFSS.
References
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- A Compact Octagonal Patch Antenna With U-Shaped Slot and DGS For UWB Applications
Abstract Views :106 |
PDF Views:1
Authors
Affiliations
1 Department of Electronics and Communication Engineering, Rajiv Gandhi College of Engineering College, IN
1 Department of Electronics and Communication Engineering, Rajiv Gandhi College of Engineering College, IN
Source
ICTACT Journal on Communication Technology, Vol 13, No 2 (2022), Pagination: 2668-2672Abstract
In this article, an octagonal patch antenna with U-shaped slot for UWB application is proposed. The antenna consists of a three-layered section such as patch, Substrate and Ground. Here, Patch and Ground are the perfectly conducting foil mounted on a Flame Retardant 4 (FR -4) dielectric material whose permittivity Ɛr = 4.4 and loss tangent δ = 0.002. The radiating element and ground are fed through a microstrip line using a Lumped Port. A U- shaped slot is etched on the center of patch to disseminate the surface current throughout the patch whose sectional area is 15 x 15 mm2. Also, a Defective ground Structure is introduced in the ground plane which is provides broadened bandwidth, enriched gain, improvises the radiation characteristics of the antenna with mutual coupling between the proximate sectional areas. The complete measurement of the proposed antenna is 28 x 28 x 1.6 mm3. The antenna is design and analyzed using High Frequency Simulator software (HFSS) platform. The simulated outputs of the antenna such as Reflection Co-efficient, Voltage Standing Wave Ratio (VSWR), Fractional Bandwidth (FBW), Peak Gain, Radiating Efficiency and Impedance Matching are obtained and compare with the existing designs. Thus, the proposed antenna resonates with the bandwidth of 3.7 GHz to 13.5 GHz whose Fractional Bandwidth (FBW) is 114% with a peak gain of 5.6 dBi are obtained, which denotes that the antenna is capable of radiating for UWB applications.Keywords
Antenna Configuration, FR-4, Octagonal Patch, UWB ApplicationsReferences
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- E. Aravindraj, K. Ayyappan and R. Kumar, “Performance Analysis of Rectangular MPA Using Different Substrate Materials for WLAN Application”, ICTACT Journal on Communication Technology, Vol. 8, No. 1, pp. 1447-1452, 2017.
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- E. Aravindraj, A. Kannan and K. Ayyappan, “Performance of Rectangular Microstrip Antenna in Two Different Design Tools -A Comparative Study”, International Journal of Scientific Research in Science, Engineering and Technology, Vol. 5, No. 3, pp. 13-22, 2018.
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